As wafers become larger in diameter, smaller in size, and more highly integrated, reliability testing of single unit transistors is becoming increasingly important.
Semiconductor Parametric Test System
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ESPEC
Large Capacity Thermal Shock Chamber
It is available from 1,100-liter, 1,650-liter, and 2,200-liter models. Unlike conventional chambers, this enables thermal shock testing of large automobile parts (e.g. Li-ion battery modules, electric turbochargers, intercoolers, radiators, and inverters for vehicles), large flat panel displays, and relatively large products that could not be previously tested due to their size or weight..
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ESPEC
Large capacity liquid to liquid thermal shock chamber
Three large-capacity chambers have been added to the TSB series of Liquid to Liquid Thermal Shock Chambers. Compared to the air to air thermal shock type, the liquid to liquid thermal shock type applies higher stress on the specimen, and shortens a test time.
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ESPEC
Large volume test chambers
Larger test chambers. The Platinum series chambers from ESPEC provide more workspace for temperature cycling and humidity testing to validate quality and reliability of large assemblies and completed products.
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ESPEC
Compact Ultra Low Temperature Chamber
High performance and reliability come in a compact package, covers wide range of temperature testing needs, from ultra-low temperature -85°C to high temperature +180°C.