This chamber enables dehydrogenation annealing in low-temperature polysilicon TFT fabrication, activation annealing after ion doping, high oxygen annealing in oxide semiconductor TFT fabrication, polyimide film formation for flexible display devices, semiconductor passivation film curing, and other low and high oxygen
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ESPECLarge volume test chambers
Larger test chambers. The Platinum series chambers from ESPEC provide more workspace for temperature cycling and humidity testing to validate quality and reliability of large assemblies and completed products.
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ESPECEnvironmental Stress Chamber AR Series Standard Type
The Environmental stress chamber AR series supports heat load and provides faster temperature cycling performance with a wide temperature and humidity control range. The chamber comes with user-friendly touch panel display, allows three-way access.
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ESPECLarge capacity liquid to liquid thermal shock chamber
Three large-capacity chambers have been added to the TSB series of Liquid to Liquid Thermal Shock Chambers. Compared to the air to air thermal shock type, the liquid to liquid thermal shock type applies higher stress on the specimen, and shortens a test time.
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ESPECAR Series Rapid Rate Temperature Cycle
The Environmental stress chamber AR series supports heat load and provides faster temperature cycling performance with a wide temperature and humidity control range.
