Anaerobic Oven (Less than 100ppm)
In recent years, wiring material has been changing from aluminum to copper with low resistivity. Accordingly, when heat processed in a normal chamber, copper parts oxidize, leading to flaws.
In addition, aging at 250°C is performed to inspect whether the written data on flash memory is deleted with electromigration, and bump parts oxide, so the oxygen concentration must be lowered to less than 100 ppm.
This Anaerobic Oven was developed to meet these demands. Aging tests at 350°C can be performed with an oxygen concentration of 100 ppm or less.